FEI, a provider of microscopy workflow solutions, has released the latest version of its Auto Slice & View three-dimensional (3D) reconstruction software, designed to makes 3D imaging faster, easier, more accurate, and cost effective. The software works with all of FEI’s current DualBeam focused ion beam (FIB)/scanning electron microscope (SEM) platforms to enable 3D structure and composition of samples at the nanometer scale.
The new Slice & View software 4.0 is designed to enhance productivity, precision and accuracy, and ease of use.
To affect productivity, imaging can be combined with analytical capabilities, such as energy dispersive x-ray spectrometry (EDS) and electron backscatter diffraction (EBSD), so that information is not lost in the sectioning of the sample. Automated procedures can be modified on-the-fly, with the ability to add analytical signals if an unexpected feature is revealed. Imaging and analysis can be dynamically directed to selected areas of the section or applied only on certain slices to save time. Slice & View analyses can be performed at multiple sites to allow long, unattended runs over night or weekends. Advanced tiling and stitching capabilities maintain spatial resolution over sections larger than a single field of view.
For precision and accuracy, new algorithms help to ensure uniform thickness of the slices and precise and reproducible placement of each cut.
The interface has also been redesigned to optimize user guidance. A prompted workflow approach streamlines the setup of automated procedures, and any procedure can be tagged as a template to serve as the basis for future analyses.
Image: Auto Slice & View 4 Imaging setup screen/FEI
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